XDK Molding processing
Answer
2/28/18 9:05 AM

Hi, Community,

I recently wanted to test XDK in the water.

Waterproofing is essential for placing XDK in the water.

It is also too expensive to make a waterproof case.

Therefore, we try to make a waterproof shield using the molding process.

The result will probably look like the link below.

https://www.devicemart.co.kr/9555


It is simple.

I will make a jig, insert the XDK, extend it to the switch on the board, and pull it out to make it on-off.


But if I say that it's molded,

I would like to ask if the XDK sensors are not a big problem.

Also, I wonder if the XDK is not a problem for wireless communication.

It is clear that the molding liquid is not an electrolyte and therefore has no electrical influence.

Even if the molding liquid is hardened by hardening, it is judged that there is no great influence on the transmitted vibration.

please reply.

Thank. community

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RE: XDK Molding processing
Answer
2/28/18 1:45 PM as a reply to Byun SangKyu.
Hello Byun,

Making the XDK waterproof would definitely be essential for many use cases in environments with heavy weather influence.

A waterproof shield sounds like a great idea to accomplish this. Here I think the general issue is to deal with the heating of the internal components.

First of all, I cannot confirm whether the Wi-Fi connection will still be (relatively) stable, if the XDK is put into molding liquid and placed underwater. These two factors combined make for a difficult environment, as such, it would be up to you to try it out with a prototype.

Regarding the heating of the internal components, the XDK case is not completely sealed off and allows air to flow through the casing for cooling to deal with the heating of the components. If you are going to make the case completely waterproof, then there is much need to spend some thoughts on how to transfer the heat out of the case. Especially, if you want to use the Wi-Fi chip in your XDK application.

Additionally, please keep in mind that the internal Li-Ion battery does not endure high temperatures as well.

Please let me know if this was helpful and feel free to ask if you have further questions.

Kind regards,
Franjo
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RE: XDK Molding processing
Answer
3/4/18 12:08 PM as a reply to Franjo Stjepandic.

Hello Byun,

some colleagues of mine already tried this out two years ago. It didn't work as expected. The XDK microcontroller was operational inside the mold, but not all sensors were giving the right results and no Wifi connectivity was possible. The AKU340 and the BME280 have small holes in order to allow air to the chips and these holes have to be covered before the process.

Inside the mold resin, the Wifi will behave different as with air. Furthermore Wifi and BLE do not work underwater as the signal is absorbed by the enclosing water. The recomendation is to rely on wired USB communications as this will still allow firmware flashes but be aware that USB has some length restrictions.

To avoid overheating, it may be better to remove the XDK board from the case in order to avoid an insulating air-layer between the board components and the resin.

If You still need Wifi, there are small u.lf connectors to bypass the BLE and Wifi antennas in order to connect a cable to an external antenna.

Be aware that opening the case and operating the XDK under such conditions violates the wireless certifications of the XDK

Regards,

Francisco

 

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RE: XDK Molding processing
Answer
3/6/18 5:04 PM as a reply to Francisco Llobet Blandino.
Hello Francisco,

Thank you for your additional insight on this topic.

Kind regards,
Franjo
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RE: XDK Molding processing
Answer
3/13/18 12:53 PM as a reply to Franjo Stjepandic.

Hello Byun,

as much as I understand the desire to "ruggedize" the XDK, I strongly advice against the proposed methode. As Francisco pointed out, the sensors and WLAN/BT will probably not work anymore (unfortunately, the hint with the UFL on the board is misleading - please don't try to connect an external antenna to the device!) .

If you want to try non-dry environment applications (within the temperature limits of the XDK), I recommend using an of-the -shelf housing and mounting the XDK inside. You will lose the humidity/pressure/noise sensor capabilities, but the inertial sensors would still work.

 

Mathias

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